Tan, Cher: search on Z-Library

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1

Silence and face-work in two chinese TV talk shows

Lee, Cher Leng, Chen, Yao, Tan, Gek Leng

Journal:

Discourse Context & Media

Year:

2013

Language:

english

File:

PDF, 4.06 MB

english, 2013

2

Annual Analysis of Competitiveness, Simulation Studies and Development Perspective for 34 Greater China Economies: 2000–2010 || Tibet (西藏)

Tan, Khee Giap, Yuan, Randong, Yoong, Sangiita Wei Cher, Yang, Mu

Year:

2014

Language:

english

File:

PDF, 3.37 MB

english, 2014

3

Pulse Oximeter for Low SpO2 Level Detection Using Discrete Time Signal Processing Algorithm

Pandey, Sumit, Tan, Cher Ming, Chen, Hsiao-Wen, Xie, Yao-En, Tung, Jung Hua, Kau, Yi-Chuan, Liao, Chia-Chih

Journal:

Journal of Medical Devices

Year:

2019

Language:

english

File:

PDF, 1.41 MB

english, 2019

4

[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Suntec City, Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Electromagnetic emissions from GaN power IC at varying distance and frequency

Sangwan, Vivek, Kapoor, Dipesh, Tan, Cher Ming

Year:

2018

Language:

english

File:

PDF, 693 KB

english, 2018

5

Feasibility of ISO shipping container as transitional shelter-a review

Hui Ling, Philip Chie, Tan, Cher Siang, Saggaff, Anis

Journal:

IOP Conference Series Materials Science and Engineering

Year:

2019

File:

PDF, 540 KB

2019

6

Effect of stressed-skin action on optimal design of cold-formed steel square and rectangular-shaped portal frame buildings

Wrzesien, Andrzej M., Phan, Duoc T., Lim, James B. P., Lau, Hieng-Ho, Hajirasouliha, Iman, Tan, Cher Siang

Journal:

International Journal of Steel Structures

Year:

2016

Language:

english

File:

PDF, 376 KB

english, 2016

7

Reliability screening through electrical testing for press-fit alternator power diode in automotive application

Cher Ming Tan, Joe Chiu, Robert Liu, Guan Zhang

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 490 KB

english, 2005

8

A Proposed Heutagogy Framework for Structural Steel Design in Civil Engineering Curriculum

Mohammad, Shahrin, Siang, Tan Cher, Osman, Sharifah, Jamaluddin, Nurdiana Yasmin, Mohamed Alfu, Nur Afiqah, Huei, Lee Yeong

Journal:

International Journal of Emerging Technologies in Learning (iJET)

Year:

2019

File:

PDF, 662 KB

2019

9

[IEEE 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference - Georgetown, Penang, Malaysia (2016.9.20-2016.9.22)] 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference - Palladium coated copper wire wedge integrity to withstand extended high temperature storage stress test

Chia, Lee Cher, Guan, Tan Kim, Lam, Cha Chan, Hoe, Mak Chee, Yen, Gwee Hoon

Year:

2016

Language:

english

File:

PDF, 254 KB

english, 2016

10

A scan to as-built building information modeling workflow: a case study in Malaysia

Usmani, Abdul Rahman Ahsan, Elshafey, Abdalrahman, Gheisari, Masoud, Chai, Changsaar, Aminudin, Eeydzah Binti, Tan, Cher Siang

Journal:

Journal of Engineering Design and Technology

Year:

2019

File:

PDF, 2.43 MB

2019

11

Failure mechanisms of aluminum bondpad peeling during thermosonic bonding

Cher Ming Tan,, Zhenghao Gan

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2003

Language:

english

File:

PDF, 552 KB

english, 2003

12

Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation

Chan, Marvin, Tan, Cher Ming, Lee, Kheng Chooi, Tan, Chuan Seng

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 3.28 MB

english, 2015

13

A practical framework of electrical based online state-of-charge estimation of lithium ion batteries

Leng, Feng, Tan, Cher Ming, Yazami, Rachid, Le, Minh Duc

Journal:

Journal of Power Sources

Year:

2014

Language:

english

File:

PDF, 918 KB

english, 2014

14

Analysis of humidity effects on the degradation of high-power white LEDs

Cher Ming Tan, Boon Khai Eric Chen, Gan Xu, Yuanjie Liu

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 730 KB

english, 2009

15

Behavior of hot carrier generation in power SOI LDNMOS with shallow trench isolation (STI)

Jie Liao, Cher Ming Tan, Geert Spierings

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 2.28 MB

english, 2009

16

[IEEE 2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Bangalore, India (2007.07.11-2007.07.13)] 2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Statistical Analysis of Multi-Censored Electromigration Data using the EM Algorithm

Raghavan, Nagarajan, Tan, Cher Ming

Year:

2007

Language:

english

File:

PDF, 2.80 MB

english, 2007

17

Degradation Model of a Linear-Mode LED Driver and its Application in Lifetime Prediction

Lan, Song, Tan, Cher Ming

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 1.74 MB

english, 2014

18

Determination of the dice forward I–V characteristics of a power diode from a packaged device and its applications

Cher Ming Tan, Zhenghao Gan, Wai Fung Ho, Sam Chen, Robert Liu

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 410 KB

english, 2005

19

Theory and Practice of Quality and Reliability Engineering in Asia Industry ||

Tan, Cher Ming, Goh, Thong Ngee

Year:

2017

Language:

english

File:

PDF, 9.41 MB

english, 2017

20

Feasibility study of the application of voltage contrast to printed circuit board

Cher Ming Tan, Zhenghao Gan, Tai Chong Chai

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 750 KB

english, 2006

21

Effect of Temperature on the Aging rate of Li Ion Battery Operating above Room Temperature

Leng, Feng, Tan, Cher Ming, Pecht, Michael

Journal:

Scientific Reports

Year:

2015

Language:

english

File:

PDF, 1.31 MB

english, 2015

22

Fresh and hardened properties of lightweight foamed concrete with palm oil fuel ash as filler

Lim, Siong Kang, Tan, Cher Siang, Lim, Ooi Yuan, Lee, Yee Ling

Journal:

Construction and Building Materials

Year:

2013

Language:

english

File:

PDF, 1.95 MB

english, 2013

23

Mathematical model of low-temperature wafer bonding under medium vacuum and its application

Wei Bo Yu,, Jun Wei,, Cher Ming Tan,, Guang Yu Huang,

Journal:

IEEE Transactions on Advanced Packaging

Year:

2005

Language:

english

File:

PDF, 350 KB

english, 2005

24

Reactivity of adsorbed CO toward C2H4, H2, and NO on the surface of supported rhodium catalysts

Steven S.C. Chuang, Raja Krishnamurthy, Cher-Dip Tan

Journal:

Colloids and Surfaces A: Physicochemical and Engineering Aspects

Year:

1995

Language:

english

File:

PDF, 891 KB

english, 1995

25

A Reliability Statistics Perspective on the Pitfalls of Standard Wafer-Level Electromigration Accelerated Test (SWEAT)

Cher Ming Tan, Kelvin Ngan Chong Yeo

Journal:

Journal of Electronic Testing

Year:

2001

Language:

english

File:

PDF, 116 KB

english, 2001

26

Application of Particle Filter Technique for Lifetime Determination of a LED Driver

Lan, Song, Tan, Cher Ming

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2015

Language:

english

File:

PDF, 8.97 MB

english, 2015

27

SPIE Proceedings [SPIE International Symposium on Microelectronics and Assembly - Singapore, Singapore (Monday 27 November 2000)] Microelectronic Yield, Reliability, and Advanced Packaging - Measurement of thermal deformation of IC packages using the AFM scanning moire technique

Zhong, Zhaowei, Lu, Yunguang, Xie, Huimin, Ngoi, Bryan K. A., Yu, Jin, Chai, Gin B., Asundi, Anand K., Tan, Cher Ming, Peng, Yeng-Kaung, Mahalingam, Mali, Prasad, Krishnamachar

Year:

2000

Language:

english

File:

PDF, 901 KB

english, 2000

28

Utilizing high volumes quarry wastes in the production of lightweight foamed concrete

Lim, Siong Kang, Tan, Cher Siang, Li, Bo, Ling, Tung-Chai, Hossain, Md. Uzzal, Poon, Chi Sun

Journal:

Construction and Building Materials

Year:

2017

Language:

english

File:

PDF, 1.70 MB

english, 2017

29

Finite element modeling of capacitive coupling voltage contrast

Cher Ming Tan, Stanny Yanuar, Tai Chong Chai

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 1.14 MB

english, 2007

30

Electromigration in width transition copper interconnect

Arijit Roy, Yuejin Hou, Cher Ming Tan

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 510 KB

english, 2009

31

Modeling and analysis of gate-all-around silicon nanowire FET

Chen, Xiangchen, Tan, Cher Ming

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 1.89 MB

english, 2014

32

[IEEE 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - singapore (2008.07.7-2008.07.11)] 2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Statistical modeling of via redundancy effects on interconnect reliability

Raghavan, Nagarajan, Cher Ming Tan,

Year:

2008

Language:

english

File:

PDF, 205 KB

english, 2008

33

Evaluation of the Potential Electromagnetic Interference in Vertically Stacked 3D Integrated Circuits

Kapoor, Dipesh, Tan, Cher Ming, Sangwan, Vivek

Journal:

Applied Sciences

Year:

2020

File:

PDF, 21.47 MB

2020

34

Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist

Cher Ming Tan, Kim Peng Lim, Tai Chong Chai, Guat Cheng Lim

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 461 KB

english, 2005

35

Room temperature observation of point defect on gold surface using thermovoltage mapping

Arijit Roy, Cher Ming Tan, Sean J. O’Shea, Kedar Hippalgaonkar, Wulf Hofbauer

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 629 KB

english, 2007

36

Experimental Tests on Composite Beam with Various Slab Systems

Saggaff, Anis, Tahir, Mahmood Md, Jamaluddin, Norwati, Shek, Poi Ngian, Tan, Cher Siang

Journal:

Applied Mechanics and Materials

Year:

2012

Language:

english

File:

PDF, 396 KB

english, 2012

37

ICMAT 2011 – Reliability and variability of semiconductor devices and ICs

Asen Asenov, Ulf Schlichtmann, Cher Ming Tan, Hei Wong, Xing Zhou

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 108 KB

english, 2012

38

Reply to comments on “A framework to practical predictive maintenance modeling for multi-state systems”

Cher Ming Tan, Nagarajan Raghavan

Journal:

Reliability Engineering & System Safety

Year:

2009

Language:

english

File:

PDF, 88 KB

english, 2009

39

Solvent-Assisted Laser Drilling of Silicon Carbide

Lee Mein Wee, Ling Eng Khoong, Chi Wai Tan, Gnian Cher Lim

Journal:

International Journal of Applied Ceramic Technology

Year:

2011

Language:

english

File:

PDF, 1.22 MB

english, 2011

40

Nondestructive void size determination in copper metallization under passivation

Zhenghao Gan,, Cher Ming Tan,, Guan Zhang,

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2003

Language:

english

File:

PDF, 844 KB

english, 2003

41

Experimental Investigation of Retrofitted Extended End-Plate Connections

Shek, Poi Ngian, Tahir, Mahmood Md, Tan, Cher Siang, Sulaiman, Arizu

Journal:

Applied Mechanics and Materials

Year:

2013

Language:

english

File:

PDF, 240 KB

english, 2013

42

Methodology of reliability enhancement for high power LED driver

Lan, Song, Tan, Cher Ming, Wu, Kevin

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 4.61 MB

english, 2014

43

Circuit level interconnect reliability study using 3D circuit model

Feifei He, Cher Ming Tan

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 3.08 MB

english, 2010

44

[IEEE 2007 2nd IEEE Conference on Industrial Electronics and Applications - Harbin, China (2007.05.23-2007.05.25)] 2007 2nd IEEE Conference on Industrial Electronics and Applications - The Physical Limit and Manufacturability of Power Diode with Carrier Lifetime Control

Tan, Cher Ming, Sun, Lina, Raghavan, Nagarajan, Huang, Guangyu, Hsu, Chuck, Wang, Chase

Year:

2007

File:

PDF, 494 KB

2007

45

[IEEE 2017 Annual Reliability and Maintainability Symposium (RAMS) - Orlando, FL, USA (2017.1.23-2017.1.26)] 2017 Annual Reliability and Maintainability Symposium (RAMS) - Reliability paradox for worldwide automotive electronics

Tan, Cher Ming, Narula, Udit, Kapoor, Dipesh

Year:

2017

Language:

english

File:

PDF, 1.43 MB

english, 2017

46

Influence of applied load on vacuum wafer bonding at low temperature

Wei Bo Yu, Cher Ming Tan, Jun Wei, Shu Sheng Deng, Sharon Mui Ling Nai

Journal:

Sensors and Actuators A: Physical

Year:

2004

Language:

english

File:

PDF, 232 KB

english, 2004

47

Rapid ULSI Interconnect Reliability Analysis Using Neural Networks

Tian, Yizhen, He, Feifei, Zhang, Qi-Jun, Tan, Cher Ming, Ma, Jianguo

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 526 KB

english, 2014

48

Effect of BOE etching time on wire bonding quality

Cher Ming Tan,, Linggajaya, K., Er, E., Chai, V.S.-H.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

1999

Language:

english

File:

PDF, 480 KB

english, 1999

49

Optimal maintenance strategy of deteriorating system under imperfect maintenance and inspection using mixed inspectionscheduling

Le, Minh Duc, Tan, Cher Ming

Journal:

Reliability Engineering & System Safety

Year:

2013

Language:

english

File:

PDF, 294 KB

english, 2013

50

[IEEE Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 - Taiwan (5-8 July 2004)] Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 (IEEE Cat. No.04TH8743) - Finite element modeling of residual mechanical stress in partial SOI structure due to wafer bonding processing

Guangyu Huang,, Cher Ming Tan,, Zhenghao Gan,, Wei Jun,, Guan Zhang,, Weibo Yu,

Year:

2004

Language:

english

File:

PDF, 206 KB

english, 2004

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